Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips-Reference-Cited by-同舟云学术

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Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Author:

Wu Sheng-Tsai,Chien Heng-Chieh,Lau John H.,Li Ming,Cline Julia,Ji Mandy

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575766.pdf?arnumber=6575766

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23

3. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01

4. Multiple System and Heterogeneous Integration with TSV-Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023

5. An EIC on PIC packaging solution for photonic engine of 800G data rate and beyond;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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