Development of a Low CTE chip scale package-Reference-Cited by-同舟云学术

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Development of a Low CTE chip scale package

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Author:

Yamada Tomoyuki,Fukui Masahiro,Terada Kenji,Harazono Masaaki,Reynolds Charles,Audet Jean,Iruvanti Sushumna,Liu Hsichang,Moore Scott,Pan Yi,Zhang Hongqing

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575688.pdf?arnumber=6575688

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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