Wafer Level Multi-chip Gang Bonding Using TCNCF-Reference-Cited by-同舟云学术

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Wafer Level Multi-chip Gang Bonding Using TCNCF

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Ahn Seokgeun,Kim Hwankyu,Kim Dong Wook,Hiner David,Kim Keunsoo,Hwang Taekyeong,Lee Minjae,Kang Daebyoung,Yoon Juhoon

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545421.pdf?arnumber=7545421

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Micro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Advanced Flip Chip Packaging;Springer Series in Reliability Engineering;2023

3. Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

4. Comparison of 3D Packages with $20 \mu \mathrm{m}$ bump pitch using reflow soldering and thermal compression bonding;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

5. Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

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