Signal Integrity of Submicron InFO Heterogeneous Integration for High Performance Computing Applications-Reference-Cited by-同舟云学术

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Signal Integrity of Submicron InFO Heterogeneous Integration for High Performance Computing Applications

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Wang Chuei-Tang,Hsieh Jeng-Shien,Chang Victor C. Y.,Huang Shih-Ya,Ko T.,Pu Han-Ping,Yu Douglas

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811046.pdf?arnumber=8811046

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Lithographic Performance and Insulation Reliability of a Novel i-Line Photosensitive Dielectric Material;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03

4. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

5. Swelling Analysis of Negative-tone Photosensitive Dielectric Materials for Fine Pitch Redistribution Layers;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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