Multi Glass-Wafer Stacked Technology for 3D Heterogeneously-Integrated Scalable 6G Arrays-Reference-Cited by-同舟云学术

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Multi Glass-Wafer Stacked Technology for 3D Heterogeneously-Integrated Scalable 6G Arrays

Published:2024-04-15 Issue: Volume: Page:1-4
ISSN:
Container-title:2024 IEEE Wireless and Microwave Technology Conference (WAMICON)
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Author:

Aslam Shah Zaib¹,Boomhower Oliver²,Popp Jeremy³,Ebrahimi Najme⁴

Affiliation:

1. University of Florida,Electrical and Computer Engineering,Gainesville,FL,USA

2. General Electric Aerospace,General Electric Aerospace Research,Schenectady,NY,USA

3. Reality Labs,Meta Platforms,Redmond,WA,USA

4. Northeastern University,Electrical and Computer Engineering,Boston,MA,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10522823/10522798/10522862.pdf?arnumber=10522862

Reference11 articles.

1. Compact Heterogeneous Integration for Next Generation High Frequency Scalable Array with Miniaturized and Efficient Power Delivery Network;Aslam

2. A 71-76/81-86 GHz, E-band,16-Element Phased-Array Transceiver Module With Image Selection Architecture for Low EVM Variation

3. A 71–86-GHz Phased Array Transceiver Using Wideband Injection-Locked Oscillator Phase Shifters

4. RF Glass Technology Is Going Mainstream: Review and Future Applications

5. W-band and D-band Transmission Lines on Glass Based Substrates for Sub-THz Modules

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Compact 130-GHz CMOS OOK-Doubler With Embedded 10-Gb/s Modulator and Integrated Glass Antenna for Scalable Array Systems and Efficient Short-Range Communication;IEEE Microwave and Wireless Technology Letters;2024-06

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