Silicon-based system in packaging for light emitting diodes
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/6241679/6248788/06248998.pdf?arnumber=6248998
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. An experimental investigation of shear strength and adhesion on the chip-substrate joint in LED packaging;International Journal of Adhesion and Adhesives;2022-12
2. Die attachment, wire bonding, and encapsulation process in LED packaging: A review;Sensors and Actuators A: Physical;2021-10
3. Chip Scale and Wafer Level Packaging of LED s;From LED to Solid State Lighting;2021-09-17
4. Application of micro/nano technology for thermal management of high power LED packaging – A review;Applied Thermal Engineering;2018-12
5. Low Thermal-Resistance Silicon-Based Substrate for Light-Emitting Diode Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-10
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