Author:
Jacquinot Helene,Denis David
Cited by
7 articles.
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1. TSV-based Stacked Silicon Capacitor with Embedded Package Platform;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Low ESL Multi-terminal Capacitor Modeling;2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2021-12-21
3. High-frequency electrical circuit model for integrated capacitors utilizing lossy nanostructures;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
4. High-Density Small Form-Factor Package with Polygon-Shaped Capacitor Based on Silicon Technology;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
5. High performances 3D heterogeneous integrated devices based on 3D silicon capacitive interposer;2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC);2020-12-02