TSV-based Stacked Silicon Capacitor with Embedded Package Platform
Author:
Affiliation:
1. S.LSI Business, Samsung Electronics Co. Ltd.,Hwaseong-si,Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195637.pdf?arnumber=10195637
Reference20 articles.
1. Low profile integrated passive devices with 3D high density capacitors ideal for embedded and die stacking solutions
2. Ultra thin low ESL and ultra wide broadband silicon capacitors
3. A mechanically enhanced storage node for virtually unlimited height (MESH) capacitor aiming at sub 70nm DRAMs
4. Multi-terminal Ultra-thin 3D Nanoporous Silicon Capacitor Technology for High-Speed Circuits Decoupling
5. Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element
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