Extremely Advanced Substrate as an integrated Package Solution (iPaS) for Next Generation High Performance Computing (HPC) applications-Reference-Cited by-同舟云学术

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Extremely Advanced Substrate as an integrated Package Solution (iPaS) for Next Generation High Performance Computing (HPC) applications

Published:2024-05-28 Issue: Volume: Page:2053-2057
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Kitamura Tatsuya¹,Furukawa Takeshi¹,Yamada Shuhei¹,Himeda Koshi¹,Yamamoto Atsushi¹

Affiliation:

1. Murata Manufacturing Co., Ltd.,Kyoto,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565243.pdf?arnumber=10565243

Reference8 articles.

1. Chiplet Heterogeneous Integration

2. Vertical Stacked LEGO-PoL CPU Voltage Regulator

3. Minimizing the Energy Footprint of the Digital Economy With Integrated Voltage Regulators;Phillips;PwrSoC,2021

4. FIVR-Fully integrated voltage regulators on 4th generation Intal® Core™ SoCs;Burton;IEEE APEC 2014,2014

5. Advanced Packaging Architectures for Heterogeneous Integration;Mahajan;PwrSoC,2021

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