Impact of Low Temperature Solder on Electronic Package Dynamic Warpage Behavior and Requirement-Reference-Cited by-同舟云学术

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Impact of Low Temperature Solder on Electronic Package Dynamic Warpage Behavior and Requirement

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Loh Wei Keat,Kulterman Ron W.,Fu Haley,Hsu Chih Chung

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811064.pdf?arnumber=8811064

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent Advences in Laser and Laser-Assisted Bonding (LAB) Technologies for Micro-Soldering and Applications to Mini-LED;Journal of Welding and Joining;2024-08-31

2. Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding;Materials;2024-07-22

3. A Thermodynamic Modeling Approach for the Design and Development of Low-Temperature Solder Alloys;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

4. The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint;Materials Science and Engineering: A;2023-08

5. The Effect of Solder Geometry and Intermetallic Compound on Lead-Free Solder Joint Reliability;Springer Proceedings in Physics;2023

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