Author:
Tan Hong Ann,How Ho Cheng
Publisher
Springer Nature Singapore
Reference9 articles.
1. W.K. Loh et al., in Impact of Low Temperature Solder on Electronic Package Dynamic Warpage Behavior and Requirement, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), pp. 318–324 (2019)
2. M. Rayasam et al., A model for assessing the shape of solder joints in the presence of PCB and package warpage. J. Electron. Packag. 128(3), 184–191 (2006)
3. C.-S. Lau et al., Finite element analysis on the effect of solder joint geometry for the reliability of ball grid array assembly with flexible and rigid PCBS. J. Eng. Sci. Technol. 9, 47–63 (2014)
4. J.A. Depiver, S. Mallik, E.H. Amalu, Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions. Eng. Fail. Analy. 125 (2021)
5. F.X. Che, J.H.L. Pang, Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints. J. Alloys Compounds 541, 6–13 (2012)