Millimeter-Wave Wireless Intra-/Inter Chip Communications in 3D Integrated Circuits Using Through Glass Via (TGV) Disc-Loaded Patch Antennas
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545778.pdf?arnumber=7545778
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Dynamic low power management technique for decision directed inter-layer communication in three dimensional wireless network on chip;Automatika;2023-10-02
2. TSV Antennas for Multi-Band Wireless Communication;IEEE Journal on Emerging and Selected Topics in Circuits and Systems;2020-03
3. TSV‐based antenna for on‐chip wireless communication;IET Microwaves, Antennas & Propagation;2020-02-04
4. Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration;Journal of Micromechanics and Microengineering;2019-05-22
5. V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology;IEEE Access;2019
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