Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration-Reference-Cited by-同舟云学术

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Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

Published:2019-05-22 Issue:7 Volume:29 Page:075002
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Cai Han^ORCID,Yan Jun,Ma Shenglin,Luo Rongfeng^ORCID,Xia Yanming,Li Jiwei,Hu Liulin,He Shuwei,Tang Zhongjun,Jin Yufeng,Wang Wei,Chen Jing

Funder

National Natural Science Foundation of China

The Aeronautical Science Foundation of China

Collaborative Innovation Center of High-End Equipment Manufacturing in FuJian Province

TSV 3D Integrated Micro/Nanosystem Lab

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://iopscience.iop.org/article/10.1088/1361-6439/ab1d30/pdf

Reference24 articles.

1. 20" x 20" Panel Size Glass IPD Interposer Manufacturing

2. Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

3. Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling

4. Process, assembly and electromigration characteristics of glass interposer for 3D integration

5. Embedded glass interposer for heterogeneous multi-chip integration

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1. TGV through-hole double-sided electroplated copper filling mode regulation and process reliability test study;SCIENTIA SINICA Chimica;2023-09-01

2. RF Glass Technology Is Going Mainstream: Review and Future Applications;IEEE Journal of Microwaves;2023-04

3. On the optimization of molding warpage for wafer-level glass interposer packaging;Journal of Materials Science: Materials in Electronics;2023-04

4. Thermally stable single-mode glass waveguides with fiber connectors for co-packaged optics;Optical Interconnects XXI;2021-03-05

5. Study of Temperature and Time Dependent Performance Alteration of Silver Ion-exchanged Waveguides in Glass;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15

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