Analysis and Comparison of Thermal Performance of Advanced Packaging Technologies for State-of-the-Art Mobile Applications-Reference-Cited by-同舟云学术

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Analysis and Comparison of Thermal Performance of Advanced Packaging Technologies for State-of-the-Art Mobile Applications

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Hsieh Cheng-Chieh,Wu Chi-Hsi,Yu Douglas

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545611.pdf?arnumber=7545611

Cited by 34 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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