Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575818.pdf?arnumber=6575818
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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