Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization

Author:

He Hengjian1ORCID,Cai Miao1ORCID,Yun Minghui1ORCID,Chen Hao1ORCID,Wang Huanhuan1ORCID,Yang Daoguo1ORCID

Affiliation:

1. Guangxi Education Department Key Laboratory of Microelectronic Packaging and Assembly Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China

Funder

National Natural Science Foundation of China

Guangxi Natural Science Foundation Program

Innovation-Driven Development Project of Guangxi Province

Guilin Science Research and Technology Development Program

Innovation Project of GUET Graduate Education

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Reference21 articles.

1. Requirements of base material of PCB for 5G communication;Lin;Printed Circuit Inf.,2021

2. Comprehensive methodology to characterize and mitigate BGA pad cratering in printed circuit boards;Ahmad;J. SMTA,2009

3. A novel soldering method to evaluate PCB pad cratering for pin-pull testing

4. Novel Testing Instrument for Lead-Free Solder Characterization

5. Validated test method to characterize and quantify pad cratering under BGA pads on printed circuit boards;Ahmad

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