Affiliation:
1. Guangxi Education Department Key Laboratory of Microelectronic Packaging and Assembly Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
Funder
National Natural Science Foundation of China
Guangxi Natural Science Foundation Program
Innovation-Driven Development Project of Guangxi Province
Guilin Science Research and Technology Development Program
Innovation Project of GUET Graduate Education
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Reference21 articles.
1. Requirements of base material of PCB for 5G communication;Lin;Printed Circuit Inf.,2021
2. Comprehensive methodology to characterize and mitigate BGA pad cratering in printed circuit boards;Ahmad;J. SMTA,2009
3. A novel soldering method to evaluate PCB pad cratering for pin-pull testing
4. Novel Testing Instrument for Lead-Free Solder Characterization
5. Validated test method to characterize and quantify pad cratering under BGA pads on printed circuit boards;Ahmad