Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices-Reference-Cited by-同舟云学术

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Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 62nd Electronic Components and Technology Conference
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Author:

Manna A. La,Buisson T.,Detalle M.,Rebibis K. J.,Velenis D.,Zhang W.,Beyne E.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6241679/6248788/06248880.pdf?arnumber=6248880

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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