A CDM-like damage mechanism for multiple power domains fabricated with Deep N-well processes
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7932684/7936242/07936350.pdf?arnumber=7936350
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Layout Guidelines against Charging Damage from the Well-Side Antennas in Separated Power Domains;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14
2. Plasma Induced Charging Damage Causing MOS Device Reliability Lifetime Degradation Originating From Well Charging of a Technology With Deep Trench Isolation;IEEE Transactions on Device and Materials Reliability;2023-09
3. Protection Schemes for Plasma Induced Damage from Well-Side Antennas;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03
4. New Design Optimized and IC Area Efficient Rules for the Prevention of Plasma Processing Induced Damage on CMOS Circuit Reliability;2022 IEEE International Integrated Reliability Workshop (IIRW);2022-10-09
5. Plasma induced charging damage (PID) from well charging in a BCD technology with deep trenches causing MOS device reliability lifetime degradation;2022 IEEE International Integrated Reliability Workshop (IIRW);2022-10-09
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