Design challenges and solutions for ultra-high-density monolithic 3D ICs-Reference-Cited by-同舟云学术

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Design challenges and solutions for ultra-high-density monolithic 3D ICs

Published:2014-10 Issue: Volume: Page:
ISSN:
Container-title:2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
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Author:

Panth Shreepad,Samal Sandeep,Yu Yun Seop,Lim Sung Kyu

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7013424/7028176/07028195.pdf?arnumber=7028195

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fault Diagnosis for Resistive Random Access Memory and Monolithic Inter-Tier Vias in Monolithic 3-D Integration;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2024-07

2. Testing and Fault Diagnosis for Multi-level Resistive Random-Access Memory in Monolithic 3D Integration*;2024 IEEE 42nd VLSI Test Symposium (VTS);2024-04-22

3. Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC;IEEE Access;2024

4. Thermo-electro-mechanical Effects of Copper TSV Interconnects on the MOS Characteristics in Stacked 3D Integration;Lecture Notes in Networks and Systems;2024

5. Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology;2023 IEEE 41st International Conference on Computer Design (ICCD);2023-11-06

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