Ultra-high bandwidth memory with 3D-stacked emerging memory cells-Reference-Cited by-同舟云学术

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Ultra-high bandwidth memory with 3D-stacked emerging memory cells

Published:2008-06 Issue: Volume: Page:
ISSN:
Container-title:2008 IEEE International Conference on Integrated Circuit Design and Technology and Tutorial
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Author:

Keiko Abe ,Tendulkar Mihir P.,Jameson John R.,Griffin Peter B.,Kumiko Nomura ,Shinobu Fujita ,Yoshio Nishi

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4558851/4567221/04567279.pdf?arnumber=4567279

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Introduction to 3D Technologies;3D Interconnect Architectures for Heterogeneous Technologies;2022

2. NoCs in Heterogeneous 3D SoCs: Co-Design of Routing Strategies and Microarchitectures;IEEE Access;2019

3. SiO2 based conductive bridging random access memory;Journal of Electroceramics;2017-03-15

4. The Energy and Variability Efficient Era (E.V.E.) is Ahead of Us;IEEE Journal of the Electron Devices Society;2016-09

5. Looking into the future of Nanoelectronics in the Diversification Efficient Era;Science China Information Sciences;2016-05-11

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