3D CMOS integration: Introduction of dynamic coupling and application to compact and robust 4T SRAM-Reference-Cited by-同舟云学术

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3D CMOS integration: Introduction of dynamic coupling and application to compact and robust 4T SRAM

Published:2008-06 Issue: Volume: Page:
ISSN:
Container-title:2008 IEEE International Conference on Integrated Circuit Design and Technology and Tutorial
language:
Short-container-title:

Author:

Batude P.¹,Jaud M.-A.²,Thomas O.²,Clavelier L.²,Pouydebasque A.²,Vinet M.²,Deleonibus S.²,Amara A.³

Affiliation:

1. CEA/LETI-MINATEC, 17 rue des martyrs 38000 Genoble, France

2. CEA LETI, MINATEC

3. ISEP (Institut Supérieur d¿Electronique de Paris), 21 rue d'Assas, 75270 cedex 06 France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4558851/4567221/04567296.pdf?arnumber=4567296

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5. McPAT-Monolithic: An Area/Power/Timing Architecture Modeling Framework for 3-D Hybrid Monolithic Multicore Systems;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2020-10

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