A Wavelet-Based Approach in Detecting Visual Defects on Semiconductor Wafer Dies-Reference-Cited by-同舟云学术

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A Wavelet-Based Approach in Detecting Visual Defects on Semiconductor Wafer Dies

Published:2010-05 Issue:2 Volume:23 Page:284-292
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Chi-Hao Yeh ,Ful-Chiang Wu ,Wei-Lung Ji ,Chien-Yi Huang

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/66/5458317/05433029.pdf?arnumber=5433029

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1. Enhancing wafer defect detection via ensemble learning;AIP Advances;2024-08-01

2. An efficient deep learning framework for mixed-type wafer map defect pattern recognition;AIP Advances;2024-04-01

3. Defect inspection in semiconductor images using FAST-MCD method and neural network;The International Journal of Advanced Manufacturing Technology;2023-10-03

4. Review of Wafer Surface Defect Detection Methods;Electronics;2023-04-10

5. Defect Inspection in Semiconductor Images Using FAST-MCD Method and Neural Network;2023-03-20

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