Defect inspection in semiconductor images using FAST-MCD method and neural network
Author:
Funder
Samsung
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Link
https://link.springer.com/content/pdf/10.1007/s00170-023-12287-z.pdf
Reference67 articles.
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3. Baranwal AK, Pillai S, Nguyen T et al (2021) An SEM-based deep defect classification system for VSB mask writer that works with die-to-die and die-to-database inspection methods using multiple digital twins built with the state-of-the-art neural networks. In: Renwick SP (ed) photomask technology 2021, international society for optics and photonics, vol 11855. SPIE, https://doi.org/10.1117/12.2601004, 118550D
4. Bret T, Hofmann T, Edinger K (2014) Industrial perspective on focused electron beam-induced processes. Applied Physics A 117(4):1607–1614. https://doi.org/10.1007/s00339-014-8601-2
5. Butler RW, Davies PL, Jhun M (1993) Asymptotics for the minimum covariance determinant estimator. The Annals of Statistics 21(3):1385–1400. https://doi.org/10.1214/aos/1176349264
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