Chiplet Heterogeneous-Integration AI Processor-Reference-Cited by-同舟云学术

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Chiplet Heterogeneous-Integration AI Processor

Published:2023-02-05 Issue: Volume: Page:
ISSN:
Container-title:2023 International Conference on Electronics, Information, and Communication (ICEIC)
language:
Short-container-title:

Author:

Kwon Youngsu¹,Han Jinho¹,Cho Yongcheol Peter¹,Kim Juyeob¹,Chung Jaehoon¹,Choi Jaewoong¹,Park Sujin¹,Kim Igyeong¹,Kwon Hyunjeong¹,Kim Jinkyu¹,Kim Hyunmi¹,Jeon Won¹,Jeon Youngdeuk¹,Cho Minhyung¹,Choi Minseok¹

Affiliation:

1. Electronics and Telecommunications Research Institute,AI Processor Research Department,Daejeon,Republic of Korea

Funder

National Research Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10049840/10049805/10049867.pdf?arnumber=10049867

Reference4 articles.

1. 25.4 A 20nm 6GB Function-In-Memory DRAM, Based on HBM2 with a 1.2TFLOPS Programmable Computing Unit Using Bank-Level Parallelism, for Machine Learning Applications

2. AB9: A neural processor for inference acceleration

3. Compute Trends Across Three Eras of Machine Learning

4. Efficient transformers; A survey;tay;ACM Comput Surv,2022

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Energy-Efficient 10-Chiplet AI Hyperscale NPU on Large-Scale Advanced Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Research progress of hybrid bonding technology for three-dimensional integration;Microelectronics Reliability;2024-04

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