Author:
Kumagai K.,Changqi Yang ,Izumino H.,Narita N.,Shinjo K.,Iwashita S.,Nakaoka Y.,Kawamura T.,Komabashiri H.,Minato T.,Ambo A.,Suzuki T.,Zhenyu Liu ,Yang Song ,Goto S.,Ikenaga T.,Mabuchi Y.,Yoshida K.
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. ThruChip Interface;Wireless Interface Technologies for 3D IC and Module Integration;2021-09-30
2. Introduction;Wireless Interface Technologies for 3D IC and Module Integration;2021-09-30
3. 100x Evolution of Video Codec Chips;Proceedings of the 2017 ACM on International Symposium on Physical Design;2017-03-19
4. A MOO-based Methodology for Designing 3D Stacked Integrated Circuits;Journal of Multi-Criteria Decision Analysis;2013-11-04
5. Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs;IEICE Transactions on Information and Systems;2013