Fast and direct coupled-micro strip interconnect reduced-order modeling based on the finite-element method
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://xplorestaging.ieee.org/ielx5/22/34173/01629067.pdf?arnumber=1629067
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Comprehensive and Practical Way to Look at Far-End Crosstalk for Transmission Lines With Lossy Conductor and Dielectric;IEEE Transactions on Electromagnetic Compatibility;2020-04
2. Solution of skin-effect problems by means of the hybrid SDBCI method;COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering;2014-10-28
3. Analytical modelling of microstrip-like interconnections in presence of ground plane aperture;IET Microwaves, Antennas & Propagation;2009
4. A Complete Finite-Element Analysis of Multilayer Anisotropic Transmission Lines From DC to Terahertz Frequencies;IEEE Transactions on Advanced Packaging;2008-05
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