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Comprehensive and Practical Way to Look at Far-End Crosstalk for Transmission Lines With Lossy Conductor and Dielectric

  • Published:2020-04 Issue:2 Volume:62 Page:510-520
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Yong ShaohuiORCID,Khilkevich Victor,Cai Xiao-DingORCID,Sui ChunchunORCID,Sen Bidyut,Fan JunORCID

Funder

National Science Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design Methodology of Through-Silicon via for Crosstalk Optimization Based on Impedance;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20

2. Reducing crosstalk between microstrip lines using CSR structure;Engineering Reports;2023-07-30

3. Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-05

4. Crosstalk Analysis of Printed Circuit Board Traces With Right-Angled Bent Corners via Time Domain Hybrid Method;IEEE Transactions on Electromagnetic Compatibility;2022-12

5. An Empirical Modeling of Far-End Crosstalk and Insertion Loss in Microstrip Lines;IEEE Transactions on Signal and Power Integrity;2022
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