Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor-Reference-Cited by-同舟云学术

Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor

Published:2021-12-07 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Author:

Stoukatch S.¹,Fagnard J.-F.¹,Dupont F.¹,Laurent P.¹,Redoute J.-M.¹

Affiliation:

1. Liege University,Microsys lab,Department of Electrical Engineering and Computer Science,Seraing,Belgium

Funder

European Regional Development Fund

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663945.pdf?arnumber=9663945

Reference15 articles.

1. Irradiance-based emissivity correction in infrared thermography for electronic applications

2. Emissivity correction using spectrum correlation of infrared and visible images

3. Preparation and Characterization of a Thermal Insulating Carbon Xerogel-Epoxy Composite Adhesive for Electronics Applications

4. Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors;stoukatch;IEEE Transactions on Components Packaging and Manufacturing Technology,2021

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