Thermal conductivity characterization of an in-house formulated thermal insulating xerogel - epoxy composite adhesive for electronics applications-Reference-Cited by-同舟云学术

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Thermal conductivity characterization of an in-house formulated thermal insulating xerogel - epoxy composite adhesive for electronics applications

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Stoukatch Serguei¹,Fagnard Jean-Francois²,Roy Geoffrey³,Laurent Philippe²,Dupont Francois¹,Jacques Pascal J.³,Redoute Jean-Michel¹

Affiliation:

1. Liege University,Microsys lab,Department of Electrical Engineering and Computer Science,Seraing,Belgium

2. Liege University,Department of Electrical Engineering and Computer Science,Seraing,Belgium

3. Materials and process engineering, Institute of Mechanics, Materials and Civil Engineering (IMMC) Université catholique de Louvain,Louvain-la-Neuve,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939477.pdf?arnumber=9939477

Reference22 articles.

1. Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity

2. Laser-flash calorimetry I. Calibration and test on alumina heat capacity

3. Standard Test Method for Thermal Diffusivity by the Flash Method;ASTM E1461–01,0

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging Characterization;Materials;2023-09-14

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