MAXQFP: NXP new package platform-Reference-Cited by-同舟云学术

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MAXQFP: NXP new package platform

Published:2021-12-07 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Author:

Lee Chu-Chung Stephen,Tran Tu-Anh,Mawer Andrew,Daves Glenn,Pang Xs,Yao Jz

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663934.pdf?arnumber=9663934

Reference11 articles.

1. Copper Ball Voids for Pd-Cu Wires: Affecting Factors and Methods of Controlling

2. Copper versus palladium coated copper wire process and reliability differences

3. Effect of the microstructure and whisker growth propensity of Sn finish;su;Proc 55th Electronic Components Technology Conf,2005

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A High Density QFP With Hybrid Lead;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. MaxQFP: A High Density QFP;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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