Author:
Lee Chu-Chung,Mathew Varughese,Tran Tuanh,Ibrahim Rusli,Eu Poh-Leng
Cited by
11 articles.
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1. Enhancing Cu Wire-Bonding Reliability by a Cu-Selective Passivation Coating;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. A High Density QFP With Hybrid Lead;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Diffusion and Reaction Behavior of Palladium Coating and Copper Matrix Prepared by Halogen-Free Direct Coating Palladium Technology;2023
4. MaxQFP: A High Density QFP;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Reliability and Failure of Microelectronic Materials;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022