Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration

Author:

Lia Jay,Tsai Fang-Lin,Li Jackson,Pan George,Chan Mu-Hsuan,Zheng Louise,Chen Steven,Kao Nicholas,Lai David,Wan Katch,Wang Yu-Po

Publisher

IEEE

Reference10 articles.

1. Advanced packaging technologies for heterogeneous integration: challenges and opportunities;manepalli;31st Annual Electronic Packaging Symposium and Semicon West,2019

2. Scaling for heterogeneous integration;mahajan;Georgia Tech Packaging Research Center IndustryAcademic Consortium,2020

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