Funder
Deutsche Forschungsgemeinschaft Bend-IT Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
4 articles.
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1. The Chip-Level in-Plane Stress Distribution over BiCMOS Wafers;2024 IEEE 24th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF);2024-01-21
2. Characterization of Embedded and Thinned RF Chips;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
3. A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03
4. Bendable 190-GHz Transmitter on 20-μm Ultra-Thin SiGe BiCMOS;IEEE Journal on Flexible Electronics;2022-04