Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding
Author:
Affiliation:
1. Sony Semiconductor Solutions Corporation,Kanagawa,Japan
Funder
Technology Development
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816539.pdf?arnumber=9816539
Reference14 articles.
1. Fabricating 3D integrated CMOS devices by using wafer stacking and via-last TSV technologies
2. Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding
3. Statistical Distribution of Through-Silicon via Cu Pumping
4. Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations
5. Advanced wafer thinning technologies to enable multichip packages
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