Split-Fabric: A Novel Wafer-Scale Hardware Obfuscation Methodology using Silicon Interconnect Fabric-Reference-Cited by-同舟云学术

Split-Fabric: A Novel Wafer-Scale Hardware Obfuscation Methodology using Silicon Interconnect Fabric

Published:2022-05 Issue: Volume: Page:
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Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Safari Yousef¹,Yang Yu-Tao²,Iyer Subramanian S.²,Nakatani Toshifumi³,Levine Neal⁴,Vaisband Boris¹

Affiliation:

1. McGill University,The Heterogeneous Integration Knowledge (THInK) Team,ECE Department,Montreal,QC,Canada

2. University of California,UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS),ECE Department,Los Angeles,CA,USA

3. Maxentric Technologies LLC,San Diego,CA,USA

4. Defense Microelectronics Activity,McClellan Park,CA,USA

Publisher

IEEE

Link

Reference30 articles.

1. Cadence Design Systems,2021

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

2. Hybrid Obfuscation of Chiplet-Based Systems;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09

3. Secure and Scalable Key Management for Waferscale Heterogeneous Integration;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05