Advanced Thermal Integration for HPC Packages with Two-Phase Immersion Cooling
Author:
Affiliation:
1. Taiwan Semiconductor Manufacturing Company,Hsinchu,Taiwan (R.O.C.),30077
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816499.pdf?arnumber=9816499
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4. Pool-boiling enhancement by novel metallic nanoporous surface
5. Two-phase immersion a revolution in data center efficiency,2015
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