Novel plasma process for build-up film in the fine wiring fabrication-Reference-Cited by-同舟云学术

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Novel plasma process for build-up film in the fine wiring fabrication

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
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Author:

Hironiwa Daisuke¹,Morikawa Yasuhiro²,Ihori Atsuhito¹,Kamimura Ryuichiro¹

Affiliation:

1. ULVAC, Inc.,Semiconductor & Electronics Equipment Division,Kanagawa,Japan

2. ULVAC, Inc.,Institute of Advanced Technology,Shizuoka,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816386.pdf?arnumber=9816386

Reference5 articles.

1. High Rate and Low Damage Etching Method as Pre Treatment of Seed Layer Sputtering for Fan out Panel Level Packaging

2. Fabrication of Fine Via and Line / Space in Low CTE Film For Panel Fan-out Using a Dry Etching Technology

3. Fabrication of ultra-fine vias in low CTE Build-up Films using a novel dry etching technology

4. The control of material surface condition for plasma technology to fabricate advanced packaging

5. Novel insulation materials suitable for FOWLP and FOPLP

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates;Materials Today Communications;2023-12

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