10μm Pitch Bumping of Singulated Die Using a Temporary Metal-Embedded Chip Assembly Process
Author:
Affiliation:
1. HRL Laboratories, LLC,Malibu,CA,USA
Funder
Defense Advanced Research Projects Agency
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816451.pdf?arnumber=9816451
Reference6 articles.
1. Metal-Embedded Chip Assembly Processing for Enhanced RF Circuit Performance
2. Die Level Microbumping and Flip Chip Bonding for MPW Die;hollowell,2019
3. Heterogeneous Integration Technologies for Next- Generation RF and mm-Wave Subsystems;herrault;Proc CS MANTECH Conf,2018
4. Alumina Passives Using the Interconnect Layer of Metal-Embedded Chip Assembly Processing
5. Scaling Solder Micro-Bump Interconnect Down to $10\ \mu\mathrm{m}$ Pitch for Advanced 3D IC Packages
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1. Interconnects in a Multi-Layer Polymer-on-Si 50-GHz Packaging Technology;2023 16th International Conference on Advanced Technologies, Systems and Services in Telecommunications (TELSIKS);2023-10-25
2. Process Design Kit and Initial Demonstration of Digital Metal-Embedded Chip Assembly for High Density IO Fan-Out Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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