2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration
Author:
Affiliation:
1. Unimicron Technology Corporation,Taoyuan City,Taiwan
2. ASM Pacific Technology,Tsing Yi,Hong Kong
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816536.pdf?arnumber=9816536
Reference20 articles.
1. A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last
2. A Production-worthy Fan-Out Solution - ASE FOCoS Chip Last
3. Development of 2.3D High Density Organic Package using Low Temperature Bonding Process with Sn-Bi Solder
4. Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package
5. Cost Effective 2.3D Packaging Solution by using Fanout Panel Level RDL
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