Thermal Characterization and Management of GaN-on-SiC High Power Amplifier MMIC
Author:
Affiliation:
1. Institute of Microelectronics,A*STAR (Agency for Science Technology and Research),Singapore
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195586.pdf?arnumber=10195586
Reference12 articles.
1. Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices
2. Lifetesting GaN HEMTs With Multiple Degradation Mechanisms
3. Planar-Radial Structured Thermoelectric Cooler for Local Hot Spot Cooling in Mobile Electronics
4. Improved GaN-on-SiC Transistor Thermal Resistance by Systematic Nucleation Layer Growth Optimization
5. Comparison of second-harmonic matching of AlGaN/GaN HEMTs at K-band;friesicke;2014 9th European Microwave Integrated Circuit Conference,0
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1. Thermal Management of 6-in-1 SiC Power Module with Double-Sided Impingement Cooling;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Double-side Liquid Cooling Development for 6-in-1 SiC Power Module;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
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