Extremely Large 3.5D Heterogeneous Integration for the Next-Generation Packaging Technology-Reference-Cited by-同舟云学术

Extremely Large 3.5D Heterogeneous Integration for the Next-Generation Packaging Technology

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Lee Ilbok¹,Nam Soohyun¹,Kim Sungeun¹,Shin Sangho¹,Kim Younglyong¹,Seo Sun-Kyoung¹,Yu Hae Jung¹,Kim Dae-Woo¹

Affiliation:

1. AVP TD Team, Samsung Electronics Co, Ltd,Cheonan-si,Chungcheongnam- Do,South Korea

Publisher

IEEE

Link

Reference4 articles.

1. Temperature Cycling, #JESD22A-104F;JEDEC committee JC-14 1,2020

2. Amkor's 2.5D Package and HDFO - Advanced Heterogeneous Packaging Solutions;lee;Originally published in China Integrated Circuits,2018

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