Supercarrier Redistribution Layers to Realize Ultra Large 2.5D Wafer Scale Packaging by CoWoS-Reference-Cited by-同舟云学术

Supercarrier Redistribution Layers to Realize Ultra Large 2.5D Wafer Scale Packaging by CoWoS

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Hou S. Y.¹,Lee Chien Hsun¹,Wang Tsung-Ding¹,Hou Hao Cheng¹,Hu Hsieh-Pin¹

Affiliation:

1. Taiwan Semicondutor Manufaturing Company, Ltd,Hsinchu,Taiwan

Funder

R&D colleagues in tsmc

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195320.pdf?arnumber=10195320

Reference8 articles.

1. System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration

2. CoWoS Architechture Evolution for Next Generation 2.5D System in Package;hu;Proceedings of the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),2023

3. TSMC Packaging Technologies for Chiplets and 3D;yu;Proceedings of the 2021 IEEE Hot Chips 33 Symposium (HCS),2021

4. 3D IC heterogeneous integration of GPS RF receiver, baseband, and DRAM on CoWoS with system BIST solution;liao;2013 Symposium on VLSI Circuits VLSIC,2013

5. SoIS: An Ultra Large Size Integrated Substrate Technology Platform for HPC Applications;jiun;proceedings of the 2021 IEEE 71st Electronic Components and Technology Conference (ECTC),2021

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