Evaluation of Chip-Package Interaction by Means of Stress Sensors-Reference-Cited by-同舟云学术

Evaluation of Chip-Package Interaction by Means of Stress Sensors

Published:2022-07-01 Issue:13 Volume:22 Page:12959-12966
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Sun Jingyao¹,Gabani Dhruvit²,Silber Christian³^ORCID,Dietz Franz³^ORCID,Kabakchiev Alexander³,Gromala Przemyslaw³^ORCID,Thewes Roland¹,Pecanac Goran³^ORCID

Affiliation:

1. Chair of Sensor and Actuator Systems, Faculty of Electrical Engineering and Computer Science, Technical University of Berlin, Berlin, Germany

2. Department of Civil Engineering, Faculty of Engineering, University Duisburg-Essen, Duisburg, Germany

3. Robert Bosch GmbH, Reutlingen, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/7361/9812846/09777978.pdf?arnumber=9777978

Reference28 articles.

1. Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

2. New Universal Figure of Merit for Embedded Si Piezoresistive Pressure Sensors

3. Design and simulation of a novel dual current mirror based CMOS‐MEMS integrated pressure sensor

4. Novel stress measurement system for evaluation of package induced stress;kittel;Proc 2nd Eur Conf Exhib Integr Issues Miniaturized Syst -MOMS MOEMS ICS Electron Compon,2008

5. Evaluation of Mechanical Stress Induced During IC Packaging

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of Wheatstone Bridge Sensitivity for Applications in Integrated Piezoresistive Stress Sensors;2024 47th MIPRO ICT and Electronics Convention (MIPRO);2024-05-20