Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation-Reference-Cited by-同舟云学术

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Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

Published:2019-10-15 Issue:20 Volume:19 Page:9139-9148
ISSN:1530-437X
Container-title:IEEE Sensors Journal
language:
Short-container-title:IEEE Sensors J.

Author:

Prisacaru Alexandru^ORCID,Palczynska Alicja^ORCID,Gromala Przemyslaw^ORCID,Wu Bulong^ORCID,Han Bongtae^ORCID,Zhang Guoqi

Funder

Robert Bosch

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/7361/8844141/08732451.pdf?arnumber=8732451

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Study on the Derivation of KPIs for Defense CBM Operations through CBM Process Analysis;Journal of the KNST;2023-12-31

2. A feasibility study on potential of stress sensors to detect solder joint defects toward prognostics of power modules;Microelectronics Reliability;2022-10

3. Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor;Microelectronics Reliability;2022-10

4. Evaluation of Chip-Package Interaction by Means of Stress Sensors;IEEE Sensors Journal;2022-07-01

5. In-situ monitoring of thermo-mechanical induced stresses in electronic control unit – from the assembly to use in the field;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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