Hyperdimensional computing with 3D VRRAM in-memory kernels: Device-architecture co-design for energy-efficient, error-resilient language recognition-Reference-Cited by-同舟云学术

Hyperdimensional computing with 3D VRRAM in-memory kernels: Device-architecture co-design for energy-efficient, error-resilient language recognition

Published:2016-12 Issue: Volume: Page:
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Container-title:2016 IEEE International Electron Devices Meeting (IEDM)
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Author:

Li Haitong,Wu Tony F.,Rahimi Abbas,Li Kai-Shin,Rusch Miles,Lin Chang-Hsien,Hsu Juo-Luen,Sabry Mohamed M.,Eryilmaz S. Burc,Sohn Joon,Chiu Wen-Cheng,Chen Min-Cheng,Wu Tsung-Ta,Shieh Jia-Min,Yeh Wen-Kuan,Rabaey Jan M.,Mitra Subhasish,Wong H.-S. Philip

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7824662/7838021/07838428.pdf?arnumber=7838428

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