First fully functionalized monolithic 3D+ IoT chip with 0.5 V light-electricity power management, 6.8 GHz wireless-communication VCO, and 4-layer vertical ReRAM-Reference-Cited by-同舟云学术

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First fully functionalized monolithic 3D+ IoT chip with 0.5 V light-electricity power management, 6.8 GHz wireless-communication VCO, and 4-layer vertical ReRAM

Published:2016-12 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE International Electron Devices Meeting (IEDM)
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Author:

Hsueh Fu-Kuo,Shen Chang-Hong,Shieh Jia-Min,Li Kai-Shin,Chen Hsiu-Chih,Huang Wen-Hsien,Wang Hsing-Hsiang,Yang Chih-Chao,Hsieh Tung-Ying,Lin Chang-Hsien,Chen Bo-Yuan,Shiao Yu-Shao,Huang Guo-Wei,Wong Oi-Ying,Chen Po-Hung,Yeh Wen-Kuan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7824662/7838021/07838030.pdf?arnumber=7838030

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2. Monolithic 3D Integration With Photosensor and CMOS Circuits Using Ion-Cut Layer Transfer;IEEE Electron Device Letters;2022-03

3. Crystallinity Effect on Reliability of Sidewall Damascened Nanowire Poly-Si GAA FETs;2020 IEEE Silicon Nanoelectronics Workshop (SNW);2020-06

4. Heterogeneous 3D Nano-systems: The N3XT Approach?;The Frontiers Collection;2020

5. Monolithic integration of high-voltage thin-film electronics on low-voltage integrated circuits using a solution process;Nature Electronics;2019-11

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