Low-cost and TSV-free monolithic 3D-IC with heterogeneous integration of logic, memory and sensor analogy circuitry for Internet of Things-Reference-Cited by-同舟云学术

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Low-cost and TSV-free monolithic 3D-IC with heterogeneous integration of logic, memory and sensor analogy circuitry for Internet of Things

Published:2015-12 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE International Electron Devices Meeting (IEDM)
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Author:

Wu Tsung-Ta,Shen Chang-Hong,Shieh Jia-Min,Huang Wen-Hsien,Wang Hsing-Hsiang,Hsueh Fu-Kuo,Chen Hisu-Chih,Yang Chih-Chao,Hsieh Tung-Ying,Chen Bo-Yuan,Shiao Yu-Shao,Yang Chao-Shun,Huang Guo-Wei,Li Kai-Shin,Hsueh Ting-Jen,Chen Chien-Fu,Chen Wei-Hao,Yang Fu-Liang,Chang Meng-Fan,Yeh Wen-Kuan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7402013/7409598/07409765.pdf?arnumber=7409765

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