Excellent 22FDX Hot-Carrier Reliability for PA Applications-Reference-Cited by-同舟云学术

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Excellent 22FDX Hot-Carrier Reliability for PA Applications

Published:2019-06 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)
language:
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Author:

Chen T.,Zhang C.,Arfaoui W.,Bellaouar A.,Embabi S.,Bossu G.,Siddabathula M.,Chew K.W.J.,Ong S. N.,Mantravadi M.,Barnett K.,Bordelon J.,Taylor R.,Janardhanan S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8700146/8701725/08701760.pdf?arnumber=8701760

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 22FDX^Ⓡ EDMOS for 5G mmW Power Amplifier Applications;2023 18th European Microwave Integrated Circuits Conference (EuMIC);2023-09-18

2. Temperature-Dependent Study of Large-Signal Reliability of p-FET-Based Power Amplifier for mmWave Applications;IEEE Transactions on Device and Materials Reliability;2023-09

3. A Study on 28 GHz Power Amplifiers for Industrial Revolution 4.0 Compatible 5G NR FR2 IoT Transceivers;2023 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM);2023-06-09

4. Investigation of Temperature Dependence of mmWave Power Amplifier Large-Signal Reliability Performance;IEEE Transactions on Electron Devices;2023-03

5. An 88% fractional bandwidth reconfigurable power amplifier for NB-IoT and LTE-M in 22 nm CMOS FDSOI;2022 IEEE Nordic Circuits and Systems Conference (NorCAS);2022-10-25

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