Electrical modeling of Copper and Mixed Carbon bundles as a composite for 3D Interconnect applications-Reference-Cited by-同舟云学术

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Electrical modeling of Copper and Mixed Carbon bundles as a composite for 3D Interconnect applications

Published:2020-09-27 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS)
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Author:

Rao Madhav

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9265537/9265518/09265633.pdf?arnumber=9265633

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint;Microelectronic Engineering;2024-07

2. Through Silicon Vias for 3D Integration—A Mini Review;Interconnect Technologies for Integrated Circuits and Flexible Electronics;2023-09-22

3. Performance analysis of Cu/CNT-based TSV: impact on crosstalk and power;Journal of Computational Electronics;2022-09-04

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