Author:
Nishimura A.,Kawai S.,Murakami G.
Cited by
4 articles.
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1. Accurate Prediction of PQFP Warpage;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999
2. Thermomechanical Stress in a PQFP;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999
3. A Review of Package Stress Modelling;The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages;1999
4. Package Analysis: SAM and X-ray;Failure Analysis of Integrated Circuits;1999